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CCM01 Series

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CCM01 Series connectors with fixed contacts were developed for applications where a landing contact mechanism is not required

CCM01 MK II, Smart Card Connectors

Features

  • Available with 8 contacts which are designed to give a consistently reliable normal force over the life of the connector.
  • For added reliability, the card detection switch (which is normally open) is sealed against dust and debris.
  • Available with through-hole or surface mount contact termination and its lightweight design means that the connector can be automatically pick-and-placed.
  • The moldings are made from high temperature thermoplastics suited for infrared and convection soldering processes.

Construction

  1. Contacts: Copper alloy
  2. Plating:
    Contact area : Gold alloy inlay
    Terminals : Tin lead (2µ min)
  3. Moldings: High temp. thermoplastic UL 94V-0 rated
  4. Card detection switch: Stainless steel and copper alloy

Mechanical Data

  1. Number of Contacts: 8
  2. Mechanical life: 100,000 cycles min
  3. Card insertion force: 10 N max
  4. Card extraction force:
      1. 1 N min /10 N max
      2. (4N max for CCM01-2253, 2255)
  5. Contact force: 0.25 N min / 0.50 N max
  6. Card detection switch: 0.8 N max for actuation (end travel switch actuation force actuates when card is 0,9 mm from card stop); 1.8 N max for complete depression
  7. Vibration: Frequency 10 to 500 Hz. Acceleration 50m/s2 Duration 6 hours - amplitude 0,35 mm; Max electrical discontinuity 1µs
  8. Shock: Peak value 500 m/s2 – Duration 11 ms 3 shocks in each direction of each axis; Max electrical discontinuity 1 µs

Contact Electrical Data

  1. Insulation resistance: 1,000 MΩ min
  2. Resistance: 100 mΩ max
  3. Current rating: 10 µA min / 1 A max
  4. Dielectric strength: 750 Vrms min

Switch Electrical Data

  1. Card detection switch: Normally open
  2. Contact resistance: 100 mΩ max
  3. Dielectric strength: 250 Vrms min
  4. Current rating: 1 mA min / 10 mA max
  5. Maximum power: 0.2 V

Environmental Data

  1. Operating temperature: -40°C to +85°C
  2. Soldering temperature: Temperature/time profile acc. to CECC00802 para. 6.1, Fig. 3 with peak temperature 250°C
  3. Damp heat: IEC 512 test number 11c (10 days)
  4. Salt mist: IEC 512 test number 11f (96 hours)
  5. Card detection switch: Sealed against dust