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MDM, Micro D – MDM

Features


  • High performance MicropinTM contact system ( "twist pin" spring male contact and tubular socket contact)
  • Non removable crimp type contacts
  • The Connectors are supplied with the Terminations or Cables installed in factory
  • MDM Connector layout : 9, 15, 21, 25, 31, 37, 51 cavities
  • MDM contact centers : 1,27 (.050)
  • Distance between 2 adjacent contacts : 1,27 (.050)
  • Distance between 2 contact rows : 1,09 (.043)
  • Non-magnetic
  • Non-outgassing
  • Moisture and humidity seal between contacts and between contacts and shell, provided by compression interfacial seal
  • High performance Microminiature connectors, ESA qualified, for space applications.
  • Suitable for Board-to Board, Board-to Cable or Cable-to Cable applications.
  • Space/High reliability MDM connectors meet stringent tests for outgassing and residual magnetism and are suitable for use in space, medical, and high performance military/aerospace applications.
  • MDM connectors meet the performance of the ESCC 3401 and MIL-PRF-83513 Specifications and the dimensional requirements of the ESCC 3401/031 Detail Specification.

Materials and Finishes


Shells
  1. Aluminium alloy
  2. Finish A174 : 25,4 µm min. (1000 µin min.) electroless Nickel over Copper underlay
  3. Finish FR172 : 2,54 µm min. (100 µin min.) Gold over 25,4 µm min. (1000 µin min.) electroless Nickel
  4. Insulators : LCP (Liquid Crystal Polymer) thermoplastic material, UL 94-V0, glass-filled, black color
  5. Female contacts : Copper alloy / Finish : 1,27 µm (50 µin) min. Gold over Copper underlay
  6. Male contacts : Copper alloy / Finish : 1,27 µm (50 µin) min. Gold over Copper underlay
  1. MDM PCB Housings : Diallylphtalate thermoset material, UL 94-VO, glass-filled, dark green color0
  2. Interfacial Seals : Fluorosilicone elastomere, pink color
  3. Screwlocks : Stainless Steel type 303, passivated
  4. Accessories : Stainless Steel type 303, passivated
  5. Dust Caps : Polyethylene thermoplastic material, transparent pink color
  6. Encapsulant : Epoxy
  7. Uninsulated rigid Wire : Copper / Finish : 1,27 µm (50 µin) min. Gold over 2,54 (100 µin) min. Silver underlay
  8. ESCC 3901/013 Cables : Copper alloy / Finish 2,00 µm (79 µin) min. Silver / Extruded PTFE Insulation
  9. ESCC 3901/002 Cables : Copper alloy / Finish 2,00 µm (79 µin) min. Silver / Wrapped Polyimide tape Insulation
  10. MIL-W-16878/4 Cables : Copper alloy / Finish Silver coating / Extruded PTFE Insulation