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Spring Finger

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Features/Benefits

  • Ultra thin construction
  • Solderless
  • High performance in drop test
  • Reduced space on PCB

Typical Applications

  • Cell phones
  • Medical
  • MP3 player
  • Audio headsets
  • Automotive

Construction (typical)

  1. FUNCTION: Momentary action
  2. CONTACT ARRANGEMENT: Normally open
  3. CONNECTIONS: Spring Finger
  4. MOUNTING: Springloaded

Mechanical (typical)

  1. MAXIMUM ACTUATION FORCE: 20 N (4.4 lbs.)
  2. OPERATING FORCE/LIFE/TRAVEL:
  3. Actuation Force: 2 N ± 50%
  4. Life Expectancy: 100,000 operations
  5. Travel to Make: 0.15 mm+0.15/-0mm
  6. Total Travel: 0.45 mm

Electrical (typical)

  1. MAXIMUM POWER: 1 VA(Silver) ; 0.2 VA(Gold)
  2. MAXIMUM VOLTAGE: 32 V(Silver) ; 32 V(Gold)
  3. MAXIMUM CURRENT DC: 50 mA(Silver) ; 10 mA(Gold)
  4. MINIMUM CURRENT DC: 1 mA(Silver) ; 1 mA(Gold)
  5. DIELECTRIC STRENGTH: 250 vrms
  6. CONTACT RESISTANCE: ≤500 mΩ
  7. INSULATION RESISTANCE (100 VDC): 109 Ω
  8. BOUNCE TIME: < 5 ms

Environmental (typical)

  1. OPERATING TEMPERATURE: –40˚C to +85˚C
  2. STORAGE TEMPERATURE: –55˚C to 125˚C